||Shape and Size
|Monocrystalline Structure Diamonds Resin Bond System
||These low cost diamonds are the most friable, and therefore will produce minimum scratches
||Irregular shape crystals. Available in variety of sizes from 0.1 through 120 um
||This type of powder is recommended for general application when surface finish and processing cost are the most important such as steels, non-ferrous materials, carbides, and soft ceramics. Electronic grade Diamonds are available with contamination level as low as 5 PPM.
|Monocrystalline Structure Diamonds Metal Bond System
||More expensive than resin bond powder
||Blocky shape crystals. Available in variety of sizes from 0.1 through 120 um
||Recommended for specific applications when the material removal rate is most important and/or when resin bond powder is not performing up to standard, such as hard ceramics, glass, and stones. Electronic grade Diamonds are available with contamination level as low as 5 PPM.
|Polycrystalline Structure Diamond Powder
||Super high friable Diamond has multi-edge system with hundreds crystals.
||Particle shape varies from round to irregular depending on size. Available in the follow ranges: 0-0.1; 0.05-0.15, 0.05-02, 0.5-1.0; 0-1.0; 0.5-1.5; 1-2; 0-2; 1-3; 2-4, 4-8, 0-6 um.
||Recommended for applications where material removal rate and/or surface finish are more important than processing cost, and is impossible to achieve in any other way. Computer disks, optical parts, etc. Our DP3-SC Scratch Controlled powder is extremely suitable for electronic applications such as disc texturing and GMR Head lapping and polishing operations.
|Boron Carbide Powder (Dry Classified)
||Low friability Premium powder to be used instead of super friable diamonds.
||Irregular to blocky shape. Available in sizes FEPA f40 through F1500
||Slicing of Silicon Carbide and Sapphire wafers, lapping and polishing of the hard ceramics where high abrasive concentration can provide better flatness. Can provide up to 25% higher performance in slicing and lapping operations in comparison to wet classified powders.
|Silicon Carbide Powder
||This low cost material is the most friable of the carbon content abrasives.
||Particles are 99% blocky shape. Available in FEPA sizes from F220 through F1500
||General Application where cost of raw materials is critical. Used for slicing, lapping and polishing of glass and germanium wafers and lapping of piston rings and gears.