The HS-901 is a high-performance, ambient air cure, hydrophobic slick coating. It creates a covalent bond to the substrate, creating a chemical bond to the substrate. The HS-901 is an inert (benign) material when cured, giving off no odor or fumes when heated. It expels thermal heat from the substrate and is a hydrophobic and water-resistant sealer. The coating may be applied to the entire circuit board and all its components, except for main board contact points, which should be kept free of coating.
Thickness of the coating:
- HS-900 is a lower solids formulation where an extremely thing coating that dissipates heat and offers moisture protection is required yet allows for easy board/component repair or replacement.
- HS-902 is a higher solids foundations and may potentially improve water resistance, protect component betters, and improve the heat dissipation.
|Viscosity||12 sec. #2 Zahn|
|Percent of Solids||18%|
|Odor (liquid)||Slight Solvent|
|V.O.C.||Exempt per CFR 51.100/regulation 8|
|Thermal Stability (cured)||1200+ degrees F (648.8 degrees C)|
|Conical Bond (1/8 inch mandrel)||Passed (ASTM D522-93a)|
|Cross cut adhesion||5B (ASTM D3359)|
|Coefficient of Friction||0.03 microns (ASTM D2047)|
|Specific Gravity||0.889 (ASTM D891-09)|
|Pencil Hardness||8h (ASTM D3363)|
|Average applied dry film thickness||2 to 3 microns|
|Est. Coverage Rate @ 3 microns||4500 sq ft / gal|
|Dry to Touch (time @ ambient)||15-25 minutes (average)|
|Cure Time (ambient)||45-60minutes (24 hours best)|