HS-900 Thermal Dissipating Clear Silazane Circuit Board Coating

The HS-900 is a high-performance, ambient air cure, hydrophobic slick coating.  It creates a covalent bond to the substrate, creating a chemical bond to the substrate.  The HS-900 is an inert (benign) material when cured, giving off no odor or fumes when heated. It expels thermal heat from the substrate and is a hydrophobic and water-resistant sealer.  The coating may be applied to the entire circuit board and all its components, which allows for easy board/component repair, replacement, and resealing.

Thickness of the coating:

  • HS-901 and HS-902 are higher solids foundations and can potentially improve water resistance, protect component betters, and improve the heat dissipation.

Guide >>

HS-900 Properties


Color Clear
Viscosity 12 sec. #2 Zahn
Percent of Solids 12%
Odor (liquid) Slight Solvent
Odor (cured) None
V.O.C. Exempt per CFR 51.100/regulation 8
RoHS Compliant
REACH Compliant
Halogens None
Thermal Stability (cured) 1200+ degrees F (648.8 degrees C)
Conical Bond (1/8 inch mandrel) Passed (ASTM D522-93a)
Cross cut adhesion 5B (ASTM D3359)
Coefficient of Friction 0.03 microns (ASTM D2047)
Specific Gravity 0.889 (ASTM D891-09)
Pencil Hardness 8h (ASTM D3363)
Average applied dry film thickness 2 to 3 microns
Est. Coverage Rate @ 3 microns 4500 sq ft / gal
Dry to Touch (time @ ambient) 12-25 minutes (average)
Cure Time (ambient) 30-45 minutes (24 hours best)


SEE ALSO: HS-900 Series | HS-900 | HS-901 | HS-902