The HS-900 is a high-performance, ambient air cure, hydrophobic slick coating. It creates a covalent bond to the substrate, creating a chemical bond to the substrate. The HS-900 is an inert (benign) material when cured, giving off no odor or fumes when heated. It expels thermal heat from the substrate and is a hydrophobic and water-resistant sealer. The coating may be applied to the entire circuit board and all its components, which allows for easy board/component repair, replacement, and resealing.
Thickness of the coating:
- HS-901 and HS-902 are higher solids foundations and can potentially improve water resistance, protect component betters, and improve the heat dissipation.
DownloadHS-900 Properties
| Color | Clear |
| Viscosity | 12 sec. #2 Zahn |
| Percent of Solids | 12% |
| Odor (liquid) | Slight Solvent |
| Odor (cured) | None |
| V.O.C. | Exempt per CFR 51.100/regulation 8 |
| RoHS | Compliant |
| REACH | Compliant |
| Halogens | None |
| Thermal Stability (cured) | 1200+ degrees F (648.8 degrees C) |
| Conical Bond (1/8 inch mandrel) | Passed (ASTM D522-93a) |
| Cross cut adhesion | 5B (ASTM D3359) |
| Coefficient of Friction | 0.03 microns (ASTM D2047) |
| Specific Gravity | 0.889 (ASTM D891-09) |
| Pencil Hardness | 8h (ASTM D3363) |
| Average applied dry film thickness | 2 to 3 microns |
| Est. Coverage Rate @ 3 microns | 4500 sq ft / gal |
| Dry to Touch (time @ ambient) | 12-25 minutes (average) |
| Cure Time (ambient) | 30-45 minutes (24 hours best) |
SEE ALSO: HS-900 Series | HS-900 | HS-901 | HS-902